Hello team,
Can you help to clarify the purpose of the soldermask defined pads in the LMZ36002 footprint (datasheet page 37)?
My customers design allows via-in-pad, so they would like to eliminate the hatched areas in the image below, use the highlighted areas as the Cu pads, and put vias in the pads.
Do you see any thermal issues with this?
Thanks!
Errol
Texas Instruments
Field Applications Engineer