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LMZ36002: Land Pattern

Part Number: LMZ36002

Hello team,

 

Can you help to clarify the purpose of the soldermask defined pads in the LMZ36002 footprint (datasheet page 37)?

 

My customers design allows via-in-pad, so they would like to eliminate the hatched areas in the image below, use the highlighted areas as the Cu pads, and put vias in the pads.

 

Do you see any thermal issues with this? 

 


 

 

Thanks!

Errol

Texas Instruments

Field Applications Engineer

 

  • Hi Errol,

    I don't see any issues if your customer didn't use the hatched areas since the purpose of that is to have vias patterns for the those pins. Most of the thermal dissipation will go through the PGND pin. If the PCB layout has a large PGND plane, then I wouldn't be too concerned for thermals.

    Regards,
    Jimmy