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TLV743P: Thermal PAD

Part Number: TLV743P
Other Parts Discussed in Thread: TLV733P, LP5907

Hi E2E,

I use TLV743P DQN Package.

Could we let thermal PAD floating or have to connect to GND?

  • Hi Julian,

    TLV743P was designed, tested, and characterized for the Thermal Pad to be connected to the GND plane of the PCB. This is the primary heatsink for the LDO. If left unconnected you will have degraded thermal performance.

    Very Respectfully,
    Ryan
  • Hi Ryan,

    Because Our customer wnat to use TLV733P to replace LP5907 at all.

    Thermal PAD of LP5907 can floating or connect GND. At that time RD connected to system board's thermal pad but the PAD was floating.

    So RD ask to us that TLV733P thermal PAD can floating or not.

    If system board had thermal PAD but is floating, Did TLV733P's themal PAD can use it?

  • Hi Julian,

    As with the LP5907, the thermal pad for TLV733P is the primary heatsink for the LDO. For the best thermal performance the thermal pad should be connected to a large copper plane. Traditionally this plane is GND. It is important to note that, there is an electrically high impedance path between the thermal pad and the GND pin of the LDO; therefore, the copper connected to the GND pin should either be the same net as the GND pin (recommended) or electrically isolated from all other voltage nets.

    As stated previously, if the thermal pad is left unconnected, you will have degraded thermal performance.

    Very Respectfully,
    Ryan