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UCC27324-Q1: Influence of mold compound and die-attach for Thermal Resistance

Part Number: UCC27324-Q1

Hi,

The PCN is announced for the UCC27324-Q1.

The content is changing mold compound and die-attach.

Is this PCN affected for Thermal Resistance?

Best Regards,

Kuramochi

  • Hi Kuramochi,

    Thanks for your interest in our device, my name is Mamadou Diallo, AE from the High Power Drivers team.

    Given that the base element of the die attach as well as the mold compound did not change you should expect similar thermal resistance. 

    The thermal resistance would be different if the base element had changed.

    Please let us know if you have further questions or press the green button if this addressed your concern.

    Thanks.

    Regards,

    -Mamadou