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UCC28710: Total Power Dissipation (Pd) and Maximum Case Temperature (Tcmax)

Part Number: UCC28710

Hi E2E,

Good day.

Our customer is looking for the Total Power Dissipation (Pd) and Maximum Case Temperature (Tcmax) of UCC28710D. This information is not in the datasheet, is there a way to compute these parameters?

Thank you in advance for your help.

Regards,
Carlo

  • Carlo

    In the abs max section (section 7.1, page 4) of the datasheet, it's specified that the maximum junction temperature of UCC28710 is 150°C.  In the thermal information (section 7.4, page 4) of the datasheet includes the package thermal resistance.  The following app note http://www.ti.com/lit/an/spra953c/spra953c.pdf explains how to use this information to determine what the maximum case temperature and total power dissipation of UCC28710 is.  The final number depends on system level design considerations, such as airflow and PCB copper area, so they will need to calculate these parameters.

    Best Regards,

    Eric

  • In application note only available how to calculate junction temperature. Can i use same formula for finding case temperature and power dissipation

  • Carlo

    Section 2 (page 6) of the app note describes calculation from Junction-to-Case.

    The limitation for UCC28710 is that the junction temperature cannot exceed the abs max value of 150°C / recommended max value of 125°C.  How well heat can be dissipated from the package will determine what the maximum case temperature and power dissipation will be.  RθJC(top), RθJB, ψJT, ψJB parameters for UCC28710 are provided in section 7.4 (page 4) of the datasheet.  Section 2 of the app note http://www.ti.com/lit/an/spra953c/spra953c.pdf explains how to use these parameters to calculate what the maximum power and case temperature will be.  We cannot do this calculation for the customer since it depends on system parameters, such as amount of copper heatsink and airflow, which only the customer knows.

    Best Regards,

    Eric