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TLV755P: Thermal Data Inquiry

Part Number: TLV755P

Hi Team,

Upon checking the thermal data on the datasheet the RθJB Junction-to-board thermal resistance of thermally enhanced DRV package has the same value as the 5-lead DBV package (which is 64.3 °C/W).  Is this an error?  I would expect the rise from Junction to Board to be far less for a part with a powerpad vs gull wing leads.

Your inputs are highly appreciated.

Regards,

_Renan