Hi Team,
Upon checking the thermal data on the datasheet the RθJB Junction-to-board thermal resistance of thermally enhanced DRV package has the same value as the 5-lead DBV package (which is 64.3 °C/W). Is this an error? I would expect the rise from Junction to Board to be far less for a part with a powerpad vs gull wing leads.
Your inputs are highly appreciated.
Regards,
_Renan