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TPS7B82-Q1: Heat dissipation at 105C ambient

Part Number: TPS7B82-Q1

Team, 

From TPS7B8250QDRVRQ1 datasheet, R_theta_J_A = 63.9 C/ W (for HVSSOP), 72.8 C/ W (for WSON). And there is thermal pad in the IC package, my question is if we use that thermal pad for heat sinking how the R_theta_J_A number will be improved?

Basically we are trying to understand and calculate how much power this LDO can safely dissipate for a given ambient temperature (for example 105C) without getting overheated? Also, trying to understand the scope of improving thermal performance utilizing thermal pad beneath the IC.

Please let me know if you have any question or need clarifications.

Thanks

Viktorija