Hi,
Can TI provide ICEpak thermal model for thermal simulation?
Currently we based on TJ and thermal resistance to estimate maximum Tc but it is easy to fail during thermal simualtion.
| Description | QTY | TDP(W) | Sum TDP(W) | Tc SPEC(℃) | Dimension (mm) |
| LLM73605QRNPRQ1 | 1 | 2.017 | 2.017 |
125(Tj) |
6x4x0.8 |
