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TLV757P: Do we have the waveform of Max Power Dissipation vs Current at Vout=3.3V

Part Number: TLV757P

Dear team,

Could you please help answer below questions about the TLV757P?

1. When Vin=5V, Vout=3.3V, what is the maximum current the TLV757P can withstand?

2. Power dissipation*RθJA=(5-3.3)*Iout*RθJA<125-25, RθJA=231.1(SOT-23), then Iout should be smaller than 0.25A, right? But the 0.25A is too small compared with the our max current 1A. Then could you please tell me when our device can withstand 1A output current?

Thanks & Best Regards,

Sherry

  • Hi Sherry,

    For question number 1, please see the following:

    The chart was put together using the TJA for both packages and assuming a PCB temperature of 40C. Pleas note, our TJA number is based on a JEDEC standard High-K Board. An improved layout could improve the SON numbers as explained in the following application note. It has no impact on the SOT-23 as there is no thermal pad. 

    For question #2, to support 1A of current, you would need to use a lower drop-out or a device with better thermal capabilities. I found the TPS7A81 might be the best product to pitch here:

    I hope this helps.

  • Hi John,

    Thanks for your help!

    Best Regards,

    Sherry