TPS568215: Request heat dissipation guide.

Louis Han15

Genius 4680 points

Part Number: TPS568215

Hello

I have inquiries on heat dissipation.

Do you recommend radiating heat in the direction of top or board?

Could you provide a reference layout for heat dissipation to the board?

Best regards

over 3 years ago

0 Louis Han15 over 3 years ago

Genius 4680 points

Hello

I'm waiting your answer.

best regards.

0 Louis Han15 over 3 years ago in reply to Louis Han15

Genius 4680 points

Hello

When can I get an answer?

I need a quick answer.

Best regards.

0 Yuchang Zhang over 3 years ago in reply to Louis Han15

TI__Mastermind 18510 points

Hi Louis,

Sorry seems this question was missed.

For heat dissipation, generally we recommend to optimize board layout as first choice, you can put large copper plane for Vin/PGND net to improve the board dissipation ability, and also you can add some vias at PGND plane to help the thermal conducted to other layers for thermal dissipation.

And of course, if heat sink or cooling fan added, it will be better.

For layout reference, you can just take EVM design as reference.

Yuchang

Power management

Power management forum

TPS568215: Request heat dissipation guide.