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TLV702: Thermal resistance query

Part Number: TLV702

HI,

In the TLV702xx datasheet, I have found the Junction to ambient thermal resistance is very high for even WSON package. It is 321.3Deg.C/W. 

What i thought is WSON should be less thermal resistance than SOT. But here it is opposite. Can anyone explain why?

Also why huge thermal resistance(321.3Deg.C/W) ??

Thanks.

Vignesh.M

  • Hi Vignesh,

    The WSON package has a smaller lead-frame and less surface area and no thermal pad which makes it very difficult to the heat off of the die. This don't help. 

    If you are looking for a low Iq, HIgh-PSRR LDO with better thermal performance we now have the TPS7A20. In the 1x1 X2SON has a TJA of 179.1C/W.

    Does this help to answer your question?