TPS7A84: Add heat sink on the top of the device

Jason Shen

Intellectual 1945 points

Part Number: TPS7A84

Dears

I have a customer asking for the stress can be add on the top of device, but there do not have a file mentioned it, so want to know if there have some suggestion about how to add a heat sink or how much stress can be add on the top?

Thanks

Jun Shen

over 3 years ago

0 JCHK over 3 years ago

TI__Mastermind 43580 points

Hi Jason,

Adding a heat sink to the top may help but we had not modeled or tested the impact. Adding a good copper pour underneath the package goes a long way in improving thermal performance as described in the following application note.

I hope this helps.

Power management

Power management forum

TPS7A84: Add heat sink on the top of the device