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TPS22916: CAD Design Details

Part Number: TPS22916

Hi Team,

We are at the CAD stage with TPS22916 and two small details struck us:

  1. The recommended spacing between solder mask opening and exposed metal is 0.05mm MAX. We have other similar BGAs that have a spacing or 2.5 mil/0.064mm. Can we use the same spacing for TPS22916?
  2. The solder paste is shown to reach further than the exposed metal. We have never seen paste go over someting else than metal, why is that the case here?

Regards,

Ramon

  • Ramon,

    1. While probably OK, we pretty much advise to follow the NSMD spacing guidelines in TPS22916 d/s.

    2. Solder paste application slightly wider than pad is considered a good practice. One reason is the increase amount of material allows a solder ball slightly wider than pad after reflow which helps ensure good joint and complete contact by all balls. Please see section 24.2 in this pcb guidelines document, it has some good information and more detailed explanation.

    Please let me know if you have further questions on this.

    best

    dimitri