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BQ25601: About thermal via design

Part Number: BQ25601

Hi,

I didn't get a reply in the thread below.
e2e.ti.com/.../3459172
Therefore, let me post again.

We confirmed the information on page 56 before post E2E.
Customer wants to brush up the VIA design of the data sheet example in order to improve the heat dissipation characteristics.
Please advise on the following questions.



1.

The data sheet introduces nine VIAs.
Is it possible to improve the heat dissipation characteristics by further increasing it?

2.

Is it possible to make VIA diameter larger than Φ0.3?
Please tell us the number of VIA and the diameter of VIA that maximize the heat dissipation characteristics while clearing the recommended mounting conditions.

Best regards,
Yusuke