Part Number: LM3478
Tool/software: WEBENCH® Design Tools
I changed two parts, because space requirements. These parts are:
D1 = SB20150TR to TSP20U60S S1G
M1 = CSD17579Q3A to CSD17579Q56
Can you tell me what in impact is on the result
Thank you for designing with the LM3478. What is the topology do you use?
Youhao Xi, Applications Engineering?
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In reply to Youhao Xi:
I use boost topology
In reply to Piet Vaes:
I forgot to you to inform you about the load. The load is an Peltier element (TEC1-12706)
I am sorry, but I cannot find the circuit you are referring to. Is it a specific Webench design? If yes, please share.
For the diode and transistor, please check if the smaller devices are able to handle the power dissipation. As you mention they are smaller, they might have a higher junction to ambient thermal resistance.
For more information on buck-boost devices have a look at www.ti.com/buckboost
In reply to Brigitte:
The name of the design is Design : 76 LM3478MMX/NOPB
Best would be if you open the Webench design and exchange these components there as the tool calculates if the power dissipation is feasible or not.
BTW, the new transistor is CSD17579Q5A, right? I do not expect big influence by exchanging this transistor in the design.
With the new diode you should get a somewhat increased efficiency and therefore reduced board temperature.
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