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TPS40210: Boost converter layout review

Part Number: TPS40210

Hi team,

I need some assistance with a layout review of the TPS40210 in boost configuration.

The main concern is with the heat density and the thermal dissipation capability.

i can share all the necessary files via email. 

Thanks in advance for your support.

Kevin

  • Hello Kevin,

    I sent you a friendship request, you can share the files there in a private discussion.

    In general I have to mention that a visual inspection of a layout will not make sure that the power density can be handled by the board. Best would be a thermal simulation. Such a simulation can be performed if the dissipated power per component is known.

  • Thanks Brigitte, I'll send you an email. do we have a thermal simulation tool the customer can use?

    -Kevin 

  • Hello Kevin,

    As thermal modeling involves the PCB structure and TI does not offer board creation, TI does not have such a model available for customers. Normally a good starting point for thermal modeling can be the web or the PCB manufacturer.

    But in any case for a thermal model you need to take several weeks of preparation and modeling into account normally.