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TPS6521815: conformal coating

Part Number: TPS6521815

Hi,

I would like to implement conformal coating on my product.

Is it possible on TPS6521815?

  • Hello,

    Are you planning to implement the conformal coating below the device package as well or only around the PMIC?

    If you are planning to put the coating under the device, it might affect the solder reliability of the device over the life time (depends on application conditions) and it may be difficult for us to provide the confirmation on this. However, I have forwarded your request to this device expert and he may have more information on this.

    Regards,

    Murthy

  • TAKA,

    My response is the same as my colleague, Murthy :-)

    • Conformal coating around the PMIC, after assembly: There is no anticipated issue with this approach
    • Conformal coating around and under the PMIC, applied prior to assembly: TI cannot recommend this approach and there is considerable risk that the Thermal Pad underneath the device and device pins will not be soldered correctly during assembly
  • >Conformal coating around the PMIC, after assembly: There is no anticipated issue with this approach

    Here's what I want to do this time.
    I understood this.

    Thank you.