if we compare DRB(VSON) package vs DCQ(SOT-223), RθJA Junction-to-ambient thermal resistance of DRB(VSON) is very much small compared to DCQ(SOT-223): but package area of DCQ(SOT-223) is much more than DRB(VSON), i am under assumption RθJA Junction-to-ambient thermal resistance decreases with increasing size as seen in most cases of regulators. thermal data provided is correct?
whats the maximum, over temperature drop out voltage for TPS79650 @ 1A?