Hello,
I'm working on a design that has a BQ24123 on it, and on the opposite side is a large SMT connector that prevents me from putting nice GND vias under the center pad. So right now there are no vias under the pad, they're all about 100mil away from the package. Board is 10 layer, with GND on layer 2 (beneath top) and also on layer 7 & 9. So I was thinking that one way to fix this would be to use blind vias from top layer down to the GND plane right below. Would this be helpful? In the existing design (with gnd vias 100mil away) the charging current has to be reduced in order to pass emissions. Would using blind vias beneath the center pad reduce emissions?
Also, if we do use these blind vias to GND beneath the pad, should they be tented?