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LMZ10500: What tip to use for rework using hot air?

Justin Samstag
Prodigy 10 points
Part Number: LMZ10500

I am using the LMZ10500SILT in one of our products.  We believe internal damage to the board occurred during de-panelization and I need to remove the module to perform tests and replace with a new module.  What tip should I use for reworking these modules with hot air?

Thanks,

Justin Samstag

  • 0
    TI__Mastermind 18940 points
    Hello Justin,

    I have used tweezers to hold the small PCB substrate (not the inductor on top) when reworking these modules in the past.
    The hot air nozzle opening I've used was as wide as the module. You could also use smaller nozzle opening and apply hot air to the pads from the side instead of vertically. Make sure you don't exceed the maximum lead temperature of 260C.

    Regards,
    Denislav