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LMZ13608: Confirm layout recommendation for thermal vias

Part Number: LMZ13608

Hi engineers,

I'm planning to use LMZ13608 for my supply board. I would like to confirm layout recommendation for thermal vias indicated in the datasheet.

 Is this really diameter or are you referring to the drill size?

If it's the drill size, would there be significant effect if I increased it to 0.3mm?

Thank you very much.

Best Regards,

Jenny

  • Hi Jenny,

    Section 10.1(Layout Guideline) of the datasheet recommends a 10 x 10 thermal via array with a minimum via diameter of 8 mil spaced 1.5 mm apart. The minimum via refers to the drill size. 

    Something to consider when you increase the drill size to 0.3mm is the potential for the solder to be wicked into the thermal vias. Otherwise, we've seen general design rules of drill size between 8 mil - 10 mil. 

    Regards,

    Jimmy