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PTN78000W: What's the difference between PTN78000WAZ and PTN78000WAS?

Part Number: PTN78000W

Hi TI Folks,

  Good day to you.

  From datasheet, I found two difference between PTN78000WAZ and PTN78000WAS, please teach that is there any other difference ?

1. MSL Peak Temp:

PTN78000WAS:  Level-1-235C-UNLIM/Level-3-260C-168HRS --> Why there are two kind of level, please teach 

PTN78000WAZ: Level-3-260C-168 HR

2. Lead/Ball Finish:

PTN78000WAS:  SNPB 

PTN78000WAZ: SNAGCU

Best regards

Jiang WeiJi

  • Weiji:

    The only difference between “AZ” suffix and “AS” is the power pin solder ball solder content. .SMD module solder ball is located at the end of each power pin. SMD solder ball will be reflowed during final module to end customers PCB.

    During SMD solder reflow both “AS” and “AZ” SMD surface component temperatures limits are different limits for each suffix.

    PTN78000 WAZ and AZ suffix modules are lead (Pb) (free) including the power pin . AZ solder ball moisture sensitivity Level is MSL-3 with 260°C maximum solder reflow component temperature. All other components including internal solder is lead( Pb) Free

    PTN78000WAS and AS suffix modules power pin solder ball is tin (Sn 63%) lead(Pb 37%) . . All other components including internal solder is lead( Pb) Free .SMD AS tin (Sn 63%) lead(Pb 37%). solder ball are dual MSL-1/MSL-3 reflow component temperature if it exceeds 220°C .

    PTN78000WAS and AS Suffix on dual MSL-1/MSL-3 rating allows the end customer during reflow processing to use either typical lead and free reflow solder component temperatures greater than 220°C up to 260°C.

    Tom

  • Thanks Tom.