It looks like the MSL Peak Reflow Temp rating is different between SnPb packages, and NIPDAU/SNAGCU.
Is this difference only related to the melting temp of the ball finish?
Or is it related to the moisture vaporization and pressure increase of a different package/mold material?
According to J-STD-020E, Pb-Free MSL Peak Temp is 260℃, while SnPb MSL Peak Temp is 220℃ (small changes based on package size)
The 5416's DS also shows this in the MSL section for different package (lead finish) types.
Can the 5416's SnPb package be used with the same reflow settings used for the Pb-Free versions?
What are the key concerns when doing this?