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AM3358: Clarify AM3358 Thermal Resistance

Wang Carson
Prodigy 100 points
Part Number: AM3358

Hi，

We are developing a gateway based AM3358 （AM3358BZCZ）。We think it is necessary for the thermal calculation of AM3358 when SOC is running .  

At present,  The temperatrue of the test point ( located in top package , central point)  was sampled by a sensor.

My question is What  this test point is called? case ? or package top ?    Could you clarify it？ We need to figure out current Junction temperature according Table 5-12 Thermal Resistance Characteristics in SPRS717J (Datasheet). I am confusing using  RΘJC Junction-to-case  or  φJT Junction-to-package top?

Thanks a lot