Other Parts Discussed in Thread: DRA829
Hi team,
I would like to ask some questions regarding to LPDDR4 simulation showed by "spracn9b.pdf".
https://www.ti.com/lit/an/spracn9b/spracn9b.pdf
Question 1
In page.19 of "spracn9b.pdf," we can see that we have to know the on-die decoupling capacitance on the DDR supply net for both controller and DRAM.
However, sometimes we can't get the DRAM's package model including power source pads.
In this case, can we evaluate the simulation connecting power source only to SoC?
Question 2
Regarding Fig 3-11 in page.27, we can see Vix_CK_Ratio is mentioned by "Vix_CA Ratio".
Could you explain Vix_CA mean?
Question 3
Regarding Fig 3-11 in page.27, we can see we have to evaluate ring-back margins at high/low levels.
However, I couldn't find ring-back limitation or specification in JESD209-4.
https://www.jedec.org/sites/default/files/docs/JESD209-4.pdf
Could you explain which limitation matched to this evaluation item?
Question 4
Regarding to evaluation items, do we have to consider PVT conditions when configuring EYE pattern mask to test DQ, CA, CS Signals?
If we have to consider output variation from SoC due to PVT conditions, please let me know which document can be reference.
Question 5
Regarding evaluation items in page 27, we can see there is a peak to peak power noise evaluation.
Is this means that we have to confirm Vpp of DDR power lines fits absolute maximum ratings shown in DRA829 datasheets?
Thanks and Best Regards,
Junpei Kishi