Hi TI Support,
I performed one of the authenticity HST 6081 test using Dynasolve 750 on top of TI PN# TMS320C6747DZKBA3. I don't know what compound is using on the top of the device, but the epoxy is removed as in the 1st picture, and also there are some overspill around the edge of the device in 2nd picture. Please let me know if this is normal or not on this specific device package. I appreciate very much for your help.