Can TI offer this part as an EP (-55 °C) part?
Can we obtain this part with a tin-lead ball?
In general, what is underneath the lid?
Are there any pure tin components under the lid?
Is the lid vented; if so, how?
What type of SAC ball is used (305, 405)?
In the photo below, what are the four components shown in the BGA?
Are the components attached with a high-temp solder?
Will the components come off if we attempt to reball or use a longer dwell time for using the SAC?
