Hi TI Experts,
Customer is working on TDA4AP SDK9.2.
Now we successfully make our device become HS-SE after burning the dummy key (SMEK & SMPK provided by TI).
We know there are some application notes and guide for the next step to sign & encrypt the binaries & image, however they are more on SBL (customer is using SPL), and the recent SDK9.2 seems has some changes from the previous SDK.
Hence, may I know if you could summarize the steps needed to Sign & Encrypt Binaries & Image for SPL in SDK9.2 please?
Thanks!
Kevin