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TDA4AP-Q1: Grounding of the package lid; EMC testing

Sharon Heller
Prodigy 20 points
Part Number: TDA4AP-Q1

Tool/software:

Hello TI Support,

Is the metal cover (of the ALY1414A package) grounded?

Did the device had passed radiated emission/immunity testing?

Does TI test ESD on the lid?

 

Thanks a lot,

Sharon.

 

  • 0
    TI__Guru 50822 points

    Hello Sharon,

    The lid/cover of the TDA4AP SoC is not grounded.

    We have run standard EMC testing as per SAE J1752-3 / IEC 61967-2.

    We perform ESD testing to the limits specified in the datasheet:

    Regards,

    Kyle