Tool/software:
I have been working on SK-AM625 EVK board on Android SDK 09_02_00 and I tried to build the SDK myself from https://software-dl.ti.com/processor-sdk-android/esd/AM62X/09_02_00/docs/android/Overview_Building_the_SDK.html.
I got a erro message "binman: 'type' object is not subscriptable" while building `tispl.bin` and `u-boot.img` with the command below
cd ${YOUR_PATH}/ti-bootloader-aosp/ti-u-boot/
make ARCH=arm am62x_evm_a53_defconfig
make ARCH=arm am62x_android_a53.config
make ARCH=arm CROSS_COMPILE=aarch64-none-linux-gnu- \
BL31=${YOUR_PATH}/ti-bootloader-aosp/arm-trusted-firmware/build/k3/lite/release/bl31.bin \
TEE=${YOUR_PATH}/ti-bootloader-aosp/optee_os/out/arm-plat-k3/core/tee-pager_v2.bin \
BINMAN_INDIRS=${YOUR_PATH}/ti-bootloader-aosp/ti-linux-firmware
Logs:
...
UPD include/generated/timestamp_autogenerated.h
ENVC include/generated/env.txt
ENVP include/generated/env.in
ENVT include/generated/environment.h
CC cmd/version.o
AR cmd/built-in.o
CC env/common.o
AR env/built-in.o
CC lib/efi_loader/dtbdump.o
LD lib/efi_loader/dtbdump_efi.so
OBJCOPY lib/efi_loader/dtbdump.efi
CC lib/efi_loader/initrddump.o
LD lib/efi_loader/initrddump_efi.so
OBJCOPY lib/efi_loader/initrddump.efi
LD u-boot
OBJCOPY u-boot.srec
OBJCOPY u-boot-nodtb.bin
RELOC u-boot-nodtb.bin
CAT u-boot-fit-dtb.bin
COPY u-boot.bin
SYM u-boot.sym
CC spl/common/spl/spl.o
AR spl/common/spl/built-in.o
CC spl/env/common.o
AR spl/env/built-in.o
LD spl/u-boot-spl
OBJCOPY spl/u-boot-spl-nodtb.bin
FDTGREP spl/dts/k3-am625-sk.dtb
MKIMAGE spl/u-boot-spl.multidtb.fit
CAT spl/u-boot-spl-dtb.bin
COPY spl/u-boot-spl.bin
SYM spl/u-boot-spl.sym
MKIMAGE u-boot.img
MKIMAGE u-boot-dtb.img
BINMAN .binman_stamp
binman: 'type' object is not subscriptable
make: *** [Makefile:1108: .binman_stamp] Error 1
I'm not familiar with the binman code and thus do not understand the nature of the problem. Maybe you guys could help me out ?
Thanks in advance !