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TDA4VH-Q1: Assistance Needed: Confirmation of Thermal Conductivity Values & Heat source location for TDA4H SoC

Part Number: TDA4VH-Q1

Tool/software:

Hi,

We have conducted a couple of thermal simulations with the TDA4H SoC and observed some deviations compared to other TDA4 products. Could you kindly assist with the following queries:

1.The thermal conductivity values differ from other products in the same family group. I believe this might be due to some improvements, but I would like to confirm if these figures are correct.

2.For all other TI TDA4 family products, the heat sources are typically located under the die. However, in this particular model (TDA4H), the heat source appears to be on top of the die. Could you please confirm if this location is correct?

Name of the thermal model we received:

(i) TDA4 High: J784S4_package_thermal_model_221215

(ii) TDA4 Mid plus eco: J742S2_package_thermal_model_240126

Thanks for your time and attention.