TMS320DM6467T: BGA package information

shigehiro tsuda

Part Number: TMS320DM6467T

Hi,

Which is the ball structure of the DM6467T BGA package?
1. SMD
2. NSMD

Please tell me the resist diameter and land (pad) diameter.

Best Regards,
Shigehiro Tsuda

over 5 years ago

0 Pavel Botev over 5 years ago

TI__Guru**** 170625 points

Hi Shigehiro,

I made a search and I found the below info in some internal resources:

In SPRU811a (pg 20), we also provide recommendation for solder mask opening. Our recommendation is a NSMD (Non Solder Mask Defined) pad with 0.70mm opening.

www.ti.com/.../spru811a.pdf

The pad on substrate is SMD type, for PCB side the recommendation is NSMD

① Pad type :　SMD type
② Pad diameter : 　0.58mm　　　　　
③ Solder resist opening :　　0.45mm

There is also some info in datasheet (tms320dm6467t.pdf), page 351, ball diameter is from 0,45 to 0,55

Regards,
Pavel

0 shigehiro tsuda over 5 years ago in reply to Pavel Botev

Mastermind 9490 points

Hi Pavel,

Thank you for quick reply and the detailed explanation.
I can understand it with your answer.

Best Regards,
Shigehiro Tsuda

0 shigehiro tsuda over 5 years ago in reply to Pavel Botev

Mastermind 9490 points

Hi Pavel,

Thank you for your support.
Where is the description of Pad diameter: 0.58 mm?
Referring to P20 of spru811a.pdf, Copper Land is 0.52 mm.
Is this value?

Best Regards,
Shigehiro Tsuda

0 Pavel Botev over 5 years ago in reply to shigehiro tsuda

TI__Guru**** 170625 points

shigehiro tsuda said:
Where is the description of Pad diameter: 0.58 mm?

I found that info in some internal TI communication.

Regards,
Pavel

0 shigehiro tsuda over 5 years ago in reply to Pavel Botev

Mastermind 9490 points

Hi Pavel,

Thank you for quick reply.
I understood that it is TI internal information.

Best Regards,
Shigehiro Tsuda

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TMS320DM6467T: BGA package information