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AM5718: AM5718/AM5708 PCB rule

Part Number: AM5718
Other Parts Discussed in Thread: AM5708, TIDEP-0100,

Hi Champs,

We would like to ask following device PCB rule

We are looking for this material 

4.2: PCB Feature Size For Standard BGAs.

and AM5708 6-Layer PCB Reference Design

i) AM5718:

We have AM5708 above 6-layer manual.

Do we also realize 6 layer PCB at AM5718 also ?

- I believe it is able to realize it.

 According to PCB design manual "4.2: PCB Feature Size For Standard BGAs."

AM5718 0.8mm ball pitch package is able to realize maximum 10-8mil "VIA hole trace size".

If we realize 6 layers, is it able to realize 10 mil (VIa Hole trance size) ?

ii) AM5708:

According to AM5708 6 layers manual (tidue41.pdf) 2.4.3 Via Brakout Scheme,Via hole trace size set 203um.

This AM5708 package is  Via channel BGA, so spraca4.pdf ( 4.4 PCB Feature sizes For Via Channel BGAs) mentioned maxim 10-12mil Via Hole trace size at 0.65mm pitch.

So, Does AM5708 realize 12mil Via hole trace size and 6 layers solution ?

Regards,

Kz777

  • Hi,

    These questions should be discussed with the PCB manufacturer. It entirely depends on their capabilities.
  • Hi Kz777,

    We do not have a reference design for AM5718 in 6 layers. The limitation you need to worry about is not just IO usage but also thermal dissipation. If your system has high ambient air temperature or low air flow then a thinner board will not be able to keep the SoC cool. You'll need to limit the Arm frequency to reduce heat generated. This is why AM570x is limited to 1GHz.

    I'm unable to answer your other questions on hole and trace size, that is not my area. The Power Distribution Network (PDN) is an important design aspect that should take care and consideration. It's required to meet the design goals of this Sitara PDN App Note.