Other Parts Discussed in Thread: AM5708, TIDEP-0100,
Hi Champs,
We would like to ask following device PCB rule
We are looking for this material
4.2: PCB Feature Size For Standard BGAs.
and AM5708 6-Layer PCB Reference Design
i) AM5718:
We have AM5708 above 6-layer manual.
Do we also realize 6 layer PCB at AM5718 also ?
- I believe it is able to realize it.
According to PCB design manual "4.2: PCB Feature Size For Standard BGAs."
AM5718 0.8mm ball pitch package is able to realize maximum 10-8mil "VIA hole trace size".
If we realize 6 layers, is it able to realize 10 mil (VIa Hole trance size) ?
ii) AM5708:
According to AM5708 6 layers manual (tidue41.pdf) 2.4.3 Via Brakout Scheme,Via hole trace size set 203um.
This AM5708 package is Via channel BGA, so spraca4.pdf ( 4.4 PCB Feature sizes For Via Channel BGAs) mentioned maxim 10-12mil Via Hole trace size at 0.65mm pitch.
So, Does AM5708 realize 12mil Via hole trace size and 6 layers solution ?
Regards,
Kz777