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OMAPL138B-EP: PCB Material FR4 vs Polyimide

Part Number: OMAPL138B-EP
Other Parts Discussed in Thread: OMAP-L138

I am designing a digital board using TI OMAP-L138B DSP Processor. This board needs to be manufactured on a rigid PCB (flexibility NOT required). This PCB will be used in industry where desired operating temperature range is -40 to +105 degree C. Which PCB material do you recommend for such boards, whether FR4 or Polyimide?
Thanks and regards,

  • Hi,

    TI does not have recommendations on what material you should use for the PCB. This is up to the manufacturer, considering the use case for which the board is fabricated. You could take a look at OMAP-L138 LCDK design files:
      

    Check sprcaf3/OMAP L138_release_A7a/Fab/Fab_r4a/Fab.pdf, which contains notes recommending the pcb material:

    "BOARD MATERIAL SHALL BE 180 Tg/350 Td ISOLA FR-370HR...." 

    Best Regards,
    Yordan