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TMS320DM8168: Heat sink adhession issue

Part Number: TMS320DM8168

We are using the part TMS320DM8168CCYG in our project.

More than 600 quantity purchased and used.

We are using the heat sink ATS-51250D-C1-R0  of ATS (advanced thermal solution) for thermal solution

In the field at high temperature - the heat sink loosing its adhesion and coming out it.

After discussing with ATS people, they are doubting the flatness of the processor die.

Please confirm the flatness value of this processor die.

  • Hi, Ajith,

    I'll contact manufacture to look into it. During the holiday season, please expect slow response.

    Rex

  • Hi Ajith

    As Rex mentioned we will route this to the packaging team but responses maybe delayed. 

    However at the same time, please submit the same request via the guidance below:

    Submit the request to the sales support line by using the New Online Support Web Form.

     

    • Select “Quality, Reliability, Environmental”
    • In the description section please make sure you state the full orderable TI device part number.
    • Post your query above 
  • Hi, Ajith,

    The package team replied as following. Please be sure the spec is met.

    There is not an “flatness” specification of the lid or device relative to this item.

    But there are various package dimension specifications that need to be met; and a maximum tilt could be calculated from those dimensions.

    The TMS320DM8168CCYG package drawing is at http://www.ti.com/lit/ml/mpbg972d/mpbg972d.pdf accessible via the ti.com product folder.

     

    The lid material (Ni coated Cu) and Lid manufacturing process does lend itself to be quite flat.

    The lid is attached to the die to make up the package. There can be a slight tilt of the lid relative to the rest of the package.

    But the unit still must meet the package drawing above; and generally is not as extreme as could be calculated from all the measurements on the drawing.

    Rex

  • The flatness value after heating and before heating is required.

    Because we have a doubt that the flatness is varying with heating.

  • Hi, Ajith,

    Do you have the measurement as described in the package drawing of the Mechanical Data diagram? Also, how is the adhesive applied?

    Is the adhesive put on the heatsink then the heatsink put on the part or the adhesive is put on the unit top and then the heatsink placed ont he top of the part?

    Rex