I am using PN: AM3354BZCZ100 (324-LFBGA) in my design and want to run a thermal simulation.
Kindly share the internal structure of the package (dimension) to model the package in detail and run the thermal analysis.
Thanks in advance
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I am using PN: AM3354BZCZ100 (324-LFBGA) in my design and want to run a thermal simulation.
Kindly share the internal structure of the package (dimension) to model the package in detail and run the thermal analysis.
Thanks in advance
Nitheesh
There are some thermal considerations for AM335x that are maybe of value to you.
https://processors.wiki.ti.com/index.php/AM335x_Thermal_Considerations
In addition you can find the existing simulation models under the Design & development section in the link below
https://www.ti.com/product/AM3359#design-development##design-tools-simulation
Please let me know if this information does not satisfy your request.
Regards,
Thomas Krause
Hi Thomas,
I am planning to model the package in detail and run the simulation. The dimension details available in datasheet is only outer dimension.
It would be great if you could provide the internal structure(like die size, die thickness, substrate thickness , vias etc) that would help in modelling the package in detail.
Or
Can you provide the thermal model in .tzr or .pdml format?
Thanks & Regards,
Nitheesh
Nitheesh
Currently we do not have this model available and we are looking at the feasibility to generate this thermal model.
I will get back to you within one week.
Regards,
Thomas
Nitheesh
Based on your request, we are requesting creation of a thermal model and as this becomes available, it will available on ti.com.
Thank you for the feedback.
Regards,
Thomas