Hi team,
Good day.
What is the overall height tolerance of the top of the package from the mounting plane of 66AK2E05XABDA4?
Regards,
Carlo
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Carlo,
The drawing at the end of the Data Manual indicates that this height is 3.55mm maximum.
Tom
Hi Tom and Rex,
Thank you for your reply.
Our customer is trying to design a heatsink that will sit over top of the chip and compress a thermal pad against the top of the chip. In order to size that gap and the thermal pad, it's helpful to know how much the height can vary. Is it possible to get the minimum height as well?
Regards,
Carlo
Carlo,
There is no additional information beyond the figure referenced. Because of variability in thickness of the package and of the BGA balls during reflow and because the planarity cannot be guaranteed, we recommend that heat sink solutions be mounted on a spring or compression system that can tolerate the variations.
Tom