Hello,
we are currently designing multiple LDC2114 in our project.
We're currently implementing the PCB Layou and have a few questions there.
- We are plaing to route the IN-lines in the inner layer and shield the IN-lines top and bottom with COM, like it's described in the following picture
- But in the Layout Example of LDC2114 Datasheet COM Layer seems to be in the middle Layer and IN lines seem to be on bottom layer
- So how should the COM Layer be routed correctly? Should it be in middle layer under LDC2114 and top and bottom later?
- I've attached Gerber Files
Kind regards,
Clemens