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HDC2010: rework

Yusuke Mukuno
Expert 7395 points
Part Number: HDC2010

Hi expert,

TI don't recommend rework HDC2010 from datasheet description 10.1.1.3 Rework.

Could you please give me your advice for the following cases?

1. If customer will find the assemble issue on HDC2010. They would like to remove HDC2010 that is mounted on their board, also they want to exchange to new sample.

   Do you have any concern for this situation? Can they use any liquids, such as water or solvents to remove HDC2010? (Then , they use new sample for replacement.)

2. If customer will find the issue of external components that is mounted near the HDC2010, they would like to replace it. (or, re-soldering the external components)

   Do you have any concern for this situation? Can they use any liquids, such as water or solvents to remove the external components?  (Then, HDC2010 keep to mounted)

Thanks

Muk

  • +1
    TI__Expert 3270 points

    Hello Mukuno-san,

    1. If they remove the existing HDC2010 and replace it with a new device, water and solvents can be used to assist with the removal process. Before a new device is mounted, ensure that the PCB is free of any chemicals/water. 
    2. Any exposure to the chemicals could alter the humidity readings of the device. We recommend soldering the HDC in the last assembly step as it reduces the risk of damage to the sensing polymer from contaminants or excessive heat. If they want to remove any components close to the HDC2010, we do not recommend using any solvents or chemicals.

    Regards,
    Pavani

  • 0 in reply to Pavani Deepthi Tenneti
    TI__Expert 7395 points

    Pavani-san,

    Thanks

    Muk