DRV5053-Q1: DRV5053OAQLPGQ1

Hello user6533632,

I have reached out to our packaging team to see if they have any information.  It may be a day or so before I get any response from them.  In the mean time can you provide some information on how exactly you plan on applying for this package leads?

Hi, Patrick

I attach the file.

Please check it. 

Best Regards,

Moriyama

DRV5053OAQLPGQ1.xlsx

Hello user6533632,

Thank you for providing that.  I have forwarded those details to our packaging people.  I will let you know when I hear back from them.

Hello Moriyama,

I finally heard back from our packaging team.  Unfortunately we do not have simulation or bench data on that clarifies the pin lead bending limitations.  However, the packaging team did convey some risks associated with bending the pins.  One possible risk is the bending force could cause the mold body to crack.  The other risk would be the bending force damages the stitch bond thereby creating a continuity failure.  As we do not have data for various loads on the pins, we cannot comment on the probabilities of these risks.