TMP103: TMP103AYFFR　Package

Yuya Sato

Part Number: TMP103

Could you please provide the dimensional information of (A) ~ (C)?
Your prompt support would be highly appreciated, thank you!

0 Ren Schackmann over 2 years ago

Hi Yuya-san,

Dimension A, ball size, is 0.25mm

Dimension C, known as under bump metal (UBM), is 0.21mm

thanks,

ren

0 Yuya Sato over 2 years ago in reply to Ren Schackmann

Hi ren

Thanks for the prompt response.

Could you please provide the dimensional information of (B)

0 Ren Schackmann over 2 years ago in reply to Yuya Sato

Hi Yuya-san,

This device is not built on PCB. It is DSBGA. Please see https://www.ti.com/lit/snva009

This is why I gave you UBM diameter. There is no solder mask.

thanks,

ren

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