IWR6843AOP: IWR6843AOPEVM vs IWR6843ARQGALP

Parthipan Siva

Part Number: IWR6843AOP

Hi,

The altium files for the IWR6843AOPEVM (https://www.ti.com/lit/zip/sprr418) has a footprint for the IWR6843AOP that seems to differ from the datasheet https://www.ti.com/lit/ds/symlink/iwr6843aop.pdf. Also the part number in the IWR6843AOPEVM BOM (https://www.ti.com/lit/zip/swrr166 ) is XI6843ARQGALP which defers from the one in the datasheet https://www.ti.com/lit/ds/symlink/iwr6843aop.pdf which is IWR6843ARQGALP.

Why is there a difference and are there an updated schematic files for the EVM which uses the IWR6843ARQGALP?

Cheers,

over 2 years ago

0 CHETHAN KUMAR Y.B. over 2 years ago

TI__Mastermind 25795 points

Hello,

In the EVM additional provision has been provided to improve the thermal performance of the PCB. EVM size is very small hence under the BGA area array of plated through via and solder mask opening is provided to improve the thermal performance.

For more details you could refer to the below app-note.

https://www.ti.com/lit/an/swra672/swra672.pdf

EVM is developed prior to prior to device were Production version of the silicon die, hence device marking shows pre-production version. You could refer to below device errata section 2 for the marking details.

https://www.ti.com/lit/er/swrz092a/swrz092a.pdf

Currently silicon is production qualified, please use the part number from the latest datasheet.

Thanks and regards,

CHETHAN KUMAR Y.B.