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HDC3020-Q1: Discrepancy in data sheet

Ghislain Lamothe
Prodigy 20 points
Part Number: HDC3020-Q1
Other Parts Discussed in Thread: HDC3021-Q1, HDC3022-Q1

In the data sheet 'HDC3020-Q1 SNAS817A – JUNE 2021 – REVISED SEPTEMBER 2021' section 3 (Description), there is the following mention:

"The HDC302x-Q1 is an open cavity package without protective cover. Two device variants have a cover option to protect the open cavity RH sensor: HDC3021-Q1 and HDC3022-Q1. HDC3021-Q1 has removable protective tape to allow conformal coatings and PCB wash."

However, in section 11.3.2 (Soldering Reflow), there is the following mention: " When soldering the HDC302x-Q1, it is mandatory to use no-clean solder paste, and the paste must not be exposed to water or solvent rinses during assembly because these contaminants may affect sensor accuracy."

So, can the sensor be washed  following SMT reflow if it is the version with the protective cover or not?

  • 0
    TI__Expert 3270 points

    Hi Ghislain,

    Thank you for posting to the sensing forum.

    The HDC3021-Q1 has a tape cover, and is available for applications in which the board will be washed or conformally coated. The tape should be removed after these operations for accurate temperature and humidity measurements. The HDC3022-Q1 has a permanent filter installed over it, which is hydrophobic and can block particles down to 100nm. It is available for applications that might be exposed to dust or a condensing environment. It is also available for applications that might have some environmental airborne contaminants.

    Regards,
    Pavani Tenneti