Other Parts Discussed in Thread: HDC2080, HDC1080
My customer is interested in HDC and I got a question about Flux Spatter caused by void(air bubble).
HDC2010 datasheet mentions below and customer follows below statement but even if they use no-clean solder paste, flux spatter might happen because void is in no-clean solder paste.
"When soldering the HDC2010, it is mandatory to use no-clean solder paste, and the paste must not be exposed to water or solvent rinses during assembly because these contaminants may affect sensor accuracy.".
Do we have a risk that flux spatter adheres to RH sensor?
If yes, do you have any test data what flux spatter causes to the sensing accuracy?