TMP108: Need solder mask opening at component side

Hello ,

The recommended  land pattern with solder mask opening can be found in the drawing below.

https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf 

Thank you for providing the pkg drawing but it doesn't include solder mask opening size at the component side (not PCB side).  We would like to get pad type (SMD or NSMD), pad size and solder mask opening size information.

Yoshihisa,

See the information below regarding this package.  Let me know if this is sufficient for your process.

UBM Diameter = 235 +/-35.25um

UBM Thickness = 10 +/-2um

Solder Ball Pre Attach diameter: 250+/-10um

Composition: Sn (95.5%) // Ag (3.9% // Cu (0.6%)

Solder Ball Post Attach

Diameter = 260 +/-30um

Height = 190 +/-30um