This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TDC7200: burn-in process

Part Number: TDC7200

Dear e2e team,

My customer is carrying out some evaluations regarding the burn-in process that they perform on their electronic circuits before assembling them in the finished product.
In particular, their Production Engineering department is evaluating the possibility of completely eliminating it for some circuits.
Our TDC7200 ToF converter is mounted on some of these.

Do you have any advice or suggestions regarding this device?



  • Giorgia,

    Thanks for reaching out with this question.  For this test, I assume they are powering up the PCB and/or exposing the PCB to temperature stresses to help weed out potential manufacturing defects and to encourage things to settle to a stable operating point.  

    While there are no specified lifetime drift parameters in the datasheet, the device does implement a self-calibration to the internal time base using the externally supplied clock.  Given this functionality, the concern for removing the burn in for this device should be reduced. The more particular requirement that will need to be determined is quality of the clock input. 

    As far as quality related aspects of the device, it may be helpful to refer to the qualification summary: