Hello,
customer wants to encapsulate a PCB. This encapsulation is done using a hotmelt process (polyamid based thermoplast). They fear that they will have troubles over temperature if the thermoplast will flow underneath the BGA, i.e. in between PCB and package. This may lead to mechanical stress as a consequence of different CTEs of PCB, thermoplast and the BGA package. Do you have experience with such a process (encapsulation, potting, coating, underfilling) of with the IWR1443?
Regards, Holger
