Background:
In the IWR6843AOP errata,
PACKAGE#02 Surface Wave Artifact from PCB, it is recommended to either:
* Keep the Edge of PCB close to the edge of the AoP device in the E-plane
* If a larger board is needed for the solution, a trapezoid cutout with the PCB <0.3mm from the edge of the AOP.
Also
Customer may have to fill the sensor with potting, and thus must seal around the chip.
Question:
Do does this apply exclusively to PCB area?
Does there have to be air, or is it possible to fill the cut-out with some sort of plastic?
Thx,
MCV
