LM64: Die-Pad Connection

Torsten Roeder

Part Number: LM64

Hello all,
we are using the LM64 temperature sensor with WQFN package. I can't find anything in the data sheet about the connection of the die pad. Should we let float it or connect it to GND, which is better?

Greetings,
Torsten

over 2 years ago

0 Nicole Khoury over 2 years ago

TI__Genius 10080 points

Hi Torsten,

Thank you for posting to the Sensing forum.

For PCB and component temperature monitoring it is ideal to have a common ground plane between the temperature sensor and the device being measured. Connecting the die attach pad to this common ground plane will allow for the LM64 to respond more quickly to temperature changes. Section 1.2.2 of the Temperature sensors: PCB guidelines for surface mount devices application report explains heat transfer in leadless packages in more detail.

Best regards,

Nicole

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LM64: Die-Pad Connection