I am going to use TMP117 on my PCB design inside a package.
I noticed there are several sources of temperature error I have to remove to be able to gain the sub-degrees accuracy of TMP117.
1- Sun light emitting on the package will increase the temperature readings
2- Sensor mounted inside the package will have a temperature offset of about 10 degrees higher than outside in a hot environment
3- PCB layout and outline around the temperature sensor can impact the readings specially if hot components such as MCUs are sharing ground planes with the temp sensor.
I am sure there could be other sources of error that I may have not noticed than the ones listed above.
Now my question is, what is the general practice for PCB layout and outline design, sensor packaging, and etc. that can be used so that I can gain 0.1 degrees accuracy of TMP117 sensor I use and minimize all sources of temperature induced errors.
I appreciate if you advise or refer to an app. note from TI about this.
Thanks