TMP117: TMP117 DSBGA (6) - recommended soldering temperature profile

user6161363

Part Number: TMP117

HI,

TMP117 documentation focus on the importance of a proper printed board installation in order to maintain temperature reading accuracy.

The DSBGA packaging already incorporate solder balls.

Solder procedure probably implies the use of oven or IR heating.

We have not been able to find recommended temperature profile for the soldering process.

Can you provide such sayd temperature curve ?

Thanks.

Yours,

André Leroux

over 1 year ago

0 Gordon Varney over 1 year ago

TI__Expert 8810 points

André,

The solder profile is more important for the solder to reflow and attach. The important factors are the temperature limits for the part. Look at this document, on page 22 is a recommended profile. If you are using a no lead solder you will have to adjust the profile accordingly. This will not effect the TMP117 as long as you don't exceed the maximum temperature limits in this document.

https://www.ti.com/lit/pdf/ssyz015?keyMatch=BGA%20SOLDER%20PROFILE

0 user6161363 over 1 year ago in reply to Gordon Varney

Prodigy 25 points

Tank you Gordon !

fast and very efficient.

These are exactly the information we were looking for, even more answers provided than questions we had in mind.

TMP117 is a very precise temperature mesurement device. We did not wand to spoil it with bad practices.

André

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TMP117: TMP117 DSBGA (6) - recommended soldering temperature profile